Inter-layer interconnection structure for large electrical connections

An electrical interconnection structure for connection to large electrical contacts comprising:

• a semiconductor substrate having a conductive pad layer formed thereon wherein the conductive pad layer includes a plurality of elongate slots that extend through the conductive pad layer to expose the underlying semiconductor substrate, the slots having a long axis, a short axis, and sidewalls;
• a dielectric layer overlying the conductive pad layer, the dielectric layer having formed therein a plurality of elongate trenches that extend into the dielectric layer such that electrical connections to the underlying conductive pad layer can be formed wherein the plurality of elongate trenches in the dielectric layer have a long axis and a short axis and wherein the elongate trenches are configured such that the long axis of the elongate trenches in the dielectric layer lie substantially parallel to the long axis of the elongate slots in the conductive pad layer;
• and
• a plurality of elongate conductive contacts formed in the elongate trenches to establish electrical connections to the underlying conductive pad layer wherein a top portion of the elongate conductive contacts are electrically connected to other circuit elements.

An electrical interconnection structure for connection to large electrical contacts comprising:

• a semiconductor substrate having a copper pad formed thereon, the copper pad includes a plurality of elongate slots that extend into the pad to expose a portion of the underlying substrate such that the substrate is exposed, the elongate slots each including a long axis, a short axis, and sidewalls;
• a dielectric layer overlying the copper pad, the dielectric layer including a plurality of elongate bar trenches that extend into the dielectric layer such that electrical connections to the underlying conductive pad layer can be formed, the bar trenches including a long axis and a short axis;
• and
• a plurality of elongate conductive contacts that are formed in the plurality of elongate trenches establishing electrical connections to the underlying conductive pad layer.