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US 6,642,155 B1Granted
Method for applying a fluid to a rotating silicon wafer surface
AssigneeMicron Technology, Inc.
InventorsJohn D. Whitman, Jeff Johnson
Life of this patent
Estimating the term…
Abstract
A method and apparatus for applying conservative amounts of a fluid to coat a silicon wafer surface. The surface is rotated and the fluid is applied to the surface through multiple application ports. Centrifugal forces spread the fluid across the wafer surface.
Claims4
A method for applying a fluid to a silicon wafer surface comprising:
- rotating a receiving surface about an axis;
- dispensing a fluid from a first nozzle adjacent said axis onto said receiving surface;
- monitoring the outward flow of said fluid along said receiving surface;
- and
- dispensing said fluid from a second nozzle onto said receiving surface when said fluid flows outwardly to a radius from said axis, said second nozzle being remote from said first nozzle.
2 more elements
A method of applying a fluid to a silicon wafer surface comprising:
- rotating a receiving surface about an axis;
- dispensing a fluid onto said receiving surface at a first radius from said axis;
- monitoring the outward flow of said fluid from said first radius;
- and
- dispensing said fluid onto said receiving surface at a second radius from said axis when said fluid dispensed at said first radius flows to a radius from said axis.
2 more elements
Dependencies are inferred from the claim text.