Exposure method, exposure apparatus, and device manufacturing method
AssigneeNikon Corporation
InventorsKenichirou Kaneko, Toshinobu Morioka, Seiji Fujitsuka
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AssigneeNikon Corporation
InventorsKenichirou Kaneko, Toshinobu Morioka, Seiji Fujitsuka
Estimating the term…
In projecting a pattern formed on a mask onto a substrate by using a progressive focus exposure method and transferring/forming an image of the pattern on a substrate, a control unit changes the distribution of energy amounts supplied onto the substrate based on the relative positions of the imaging plane and the substrate surface, and the integrated energy amount supplied onto the substrate in accordance with the position of an irradiation area on the substrate surface which is irradiated with an energy beam through the projection optical system. With this operation, in accordance with information about the distribution of variations in resist layer thickness on the substrate, which is obtained in advance, at least one of the distribution of energy amounts and the integrated energy, which reduce the influences of this distribution, can be changed. As a consequence, the depth of focus of the projection optical system can be substantially increased, and variations in the shapes of pattern images formed on a substrate can be suppressed.
An exposure method of irradiating a mask on which a pattern is formed with an energy beam;
An exposure method of irradiating a mask on which a pattern is formed with an energy beam, and a position of a substrate in an optical axis direction of a proiection optical system is swung according to a predetermined procedure so that an irradiation area on a substrate surface irradiated with said energy beam through said projection optical system is always located in a range having a predetermined width in said optical axis direction and including said imaging plane, and a distribution of energy supplied onto said substrate surface in the optical axis direction becomes a desired distribution, thereby transferring said pattern onto said substrate, said method comprising:
An exposure method of irradiating a pattern with an energy beam and changing a positional relationship between an imaging plane of a projection optical system and a substrate in an optical axis direction of said projection optical system according to a predetermined procedure so that an irradiation area on a substrate surface irradiated with said energy beam through said projection optical system is always located in a range having a predetermined width in said optical axis direction and including said imaging plane, and a distribution of energy supplied onto said substrate surface with respect to a position of said substrate surface with datum to said imaging plane becomes a desired distribution, thereby transferring said pattern onto said substrate, said method comprising:
An exposure method of irradiating a plurality of patterns with energy beams, and transferring said plurality of patterns onto a substrate by using a projection optical system, said method comprising:
Dependencies are inferred from the claim text.