Sputtering device

A sputtering device for depositing multi-layer films on a substrate, said device comprising:

• at least one single vacuum chamber for containing said substrate for sputtering deposition;
• at least one planar-magnetron-sputtering-cathode for said sputtering deposition onto said substrate;
• at least one facing-targets-sputtering-cathode for said sputtering deposition onto said substrate;
• wherein said substrate can be moved within said single vacuum chamber between a first position for deposition thereon using said at least one planar-magnetron-sputtering-cathode, and a second position for deposition thereon using said at least one facing-targets-sputtering-cathode, and further adapted such that said at least one planar-magnetron-sputtering-cathode and said at least one facing-targets-sputtering-cathode can be atmospherically isolated from each other and said single vacuum chamber.

A method of depositing a layer of film on a substrate using a sputtering device, said method comprising the steps of:

• housing said substrate within a single vacuum chamber;
• positioning at least one planar-magnetron-sputtering-cathode and at least one facing-targets-sputtering-cathode for sputtering deposition onto said substrate;
• spinning said substrate about a central axis;
• and
• rotating at least one of said at least one planar-magnetron-sputtering-cathode and said at least one facing-targets-sputtering-cathode over said substrate through a cathode working position for sputtering deposition onto said substrate.