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US 6,641,630 B1Granted
CMP compositions containing iodine and an iodine vapor-trapping agent
AssigneeCabot Microelectronics Corporation
InventorTao Sun
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Abstract
The invention provides a chemical-mechanical polishing system, and a method of polishing using the system, comprising (a) an abrasive, a polishing pad, or both an abrasive and a polishing pad, (b) iodine, (c) an iodine vapor-trapping agent, and (d) a liquid carrier.
Claims21
A chemical-mechanical polishing system comprising:
- (a) an abrasive, a polishing pad, or both an abrasive and a polishing pad,
- (b) iodine,
- (c) an iodine vapor-trapping agent selected from the group consisting of starches and cyclodextrins, and
- (d) a liquid carrier.
1 more element
Dependencies are inferred from the claim text.