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US 6,639,795 B1Granted
Flow through butterfly backpane
OwnerSteve Cooperinventor
Life of this patent
Estimating the term…
Abstract
A backpane which receives a plurality of printed circuit boards and the backpane has air holes to allow ventilation.
Claims6
A backpane for receiving a plurality of printed circuit boards, said backpane comprising:
- a board having a length, width and height,
- aperture means positioned along said length for receiving electrical connectors,
- ventilation means positioned along said length for allowing air to flow from one side of said board to another,
- said ventilation means comprising a plurality of holes,
- said holes being positioned above and below said aperture means, and
- wherein board has a plurality of connectors positioned in each of said aperture means,
- each of said connectors having a plurality of contacts connected thereto, and
- said contacts having different lengths, and
- wherein said contacts are of three different lengths.
6 more elements
Dependencies are inferred from the claim text.