Single layer surface mount package
AssigneeStratedge Corporation
InventorsJerry L. Carter, Timothy J. Going
Life of this patent
Estimating the term…
Abstract
A single layer surface mount package suitable for use with a high frequency microelectronic device includes a lead frame partially embedded in a dielectric material and a lid. The dielectric material is integrally formed or molded into the cavities between the leads and die attach area of the lead frame such that at least the die attach area remains exposed on the top and the bottom surface of the dielectric material. A sufficient length of each lead remains exposed beyond the perimeter of the dielectric material for surface mounting to a circuit of a next level assembly.
Claims22
A surface mount package for enclosing an electronic device comprising:
- a base layer comprising:
- a lead frame having a top surface and a bottom surface, comprising;
- a center die attach area for supporting the electronic device on the top surface and for providing a ground plane connection;
- a plurality of leads adjacent to and extending outward from the center die attach area, wherein each lead of the plurality of leads is connected to a signal line of a plurality of signal lines of the electronic device;
- a dielectric material integrally formed around the plurality of leads and the center die attach area, wherein the top surface and the bottom surface of the lead frame corresponding to the center die attach area are exposed;
- and
- a cover for enclosing the electronic device.
A surface mount package comprising:
- a lead frame comprising a center die attach area adapted for attachment of an electronic device thereto and a plurality of leads adjacent to and extending from the center die attach area, the lead frame having a top surface and a bottom surface;
- a dielectric material integrally formed around the lead frame, wherein each of the top surface and bottom surface of the lead frame corresponding to the center die attach area is exposed through the dielectric material for electrical connection thereto;
- and
- a cover for enclosing the electronic device after the electronic device is attached to the top surface of the center die attach area.
A surface mount package comprising:
- a center die attach area having a first top surface and a first bottom surface, the first top surface adapted for attachment of an electronic device, wherein the center die attach area is adapted for connection to a ground plane;
- a plurality of signal leads adjacent to and extending outward from the center die attach area, the plurality of signal leads having a second top surface and a second bottom surface;
- at least one ground plane lead connected to and extending outward from the center die attach area, the at least one ground plane lead having a third top surface and a third bottom surface;
- a dielectric material integrally formed around the center die attach area, the plurality of leads, and the at least one ground plane lead wherein each of the first top surface and first bottom surface is exposed through the dielectric material;
- and
- a cover for enclosing the electronic device on the first top surface of the center die attach area after attaching the electronic device thereto.
Dependencies are inferred from the claim text.