Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuits

A thermoelectric device formed on a substrate comprising:

• a first semiconductor superlattice structure of a first conductivity type, having first and second ends;
• a second semiconductor superlattice structure of a second conductivity type, having first and second ends;
• a first conductor coupled to said first ends of said first and second semiconductor superlattice structures;
• a second conductor coupled to said second end of said first semiconductor superlattice structure;
• a third conductor coupled to said second end of said second semiconductor superlattice structure;
• and
• a voltage source coupled between said second conductor and said third conductor.

A semiconductor structure comprising:

• a substrate having a cooled area;
• at least one heat generating structure positioned on said cooled area of said substrate;
• and
• a plurality of thermoelectric cooling devices thermally connected to said substrate,
• wherein said thermoelectric cooling devices are positioned to remove heat from said cooled area of said substrate;
• and
• wherein an air gap exists between said thermoelectric cooling devices and said substrate.

A semiconductor structure comprising:

• a substrate having a cooled area;
• at least one heat generating structure positioned on said cooled area of said substrate;
• a plurality of thermoelectric cooling devices thermally connected to said substrate;
• wherein said thermoeletric cooling devices are positioned to remove heat from said cooled area of said substrate;
• and
• a plurality of conductors interconnecting and supplying power to said thermoelectric cooling devices, where in said conductors connect said thermoelectric cooling devices in series along a single current path.

A semiconductor structure comprising:

• a substrate having a cooled area;
• a least one heat generating structure positioned on said cooled area of said substrate;
• and
• a plurality of thermoelectric cooling devices thermally connected to said substrate;
• wherein said thermoelectric cooling devices are positioned to remove heat from said cooled area of said substrate;
• and
• wherein said thermoelectric cooling devices are parallel to and physically separated from said substrate such that an air gap exists between said thermoelectric cooling devices and said substrate.