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US 6,639,191 B2Granted
Hot plate unit
AssigneeIbiden Co., Ltd.
InventorsJo Saito, Masakazu Furukawa, Yasutaka Ito
Life of this patent
Estimating the term…
Abstract
A hot plate unit for heating semiconductor wafers. The hot plate unit includes a case, a hot plate, a seal element, and a holding ring. The seal element is made of a heat insulative material and is arranged between the case and the hot plate. The hot plate is clamped between the holding ring and the seal element. Screws for fastening the holding ring do not contact the hot plate.
Claims12
A hot plate unit comprising:
- a case having a lip;
- a hot plate having a heat generator, wherein the hot plate is made of sintered ceramic;
- and
- a holder for securing the hot plate to the case, wherein the holder contacts a a peripheral portion of the upper surface of the hot plate when the holder is fixed to the case;
- wherein the holder includes a flat ring, wherein the ring has a diameter substantially equal to that of the lip;
- wherein the holder includes a plurality of projections extending inwardly from the ring;
- wherein the projections contact separate points on the periphery of the upper surface of the hot plate.
4 more elements
A hot plate unit comprising:
- a case having a lip;
- a hot plate having a heat generator, wherein the hot plate is made of sintered ceramic;
- and
- a holder for securing the hot plate to the case, wherein the holder contacts a peripheral portion of the upper surface of the hot plate when the holder is fixed to the case;
- wherein the holder includes a plurality of holding plates, each holding plate having a length that is a fraction of the length of the lip.
2 more elements
Dependencies are inferred from the claim text.