Captive low-profile EMI grounding clip
AssigneeHewlett-Packard Development Company, L.P.
InventorsDaniel T. Thompson, Robert J. Hastings
Life of this patent
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AssigneeHewlett-Packard Development Company, L.P.
InventorsDaniel T. Thompson, Robert J. Hastings
Estimating the term…
An EMI clip retaining system including a flexible EMI clip with a center contact portion that bows upwards and inwards from acute bends situated at the outer ends of the EMI clip and also including enlarged end portions that extend flatly inwards from the acute bends. The EMI clip is captively installable in a planar mounting surface with tapered mounting holes through which the enlarged end portions of the EMI clip are inserted, such that once the EMI clip is installed, the enlarged ends of the EMI clip reside on a bottom side of the mounting surface while the center contact portion bows upward from the opposite, top side of the mounting surface. When the center portion is compressed flat against the top side of the mounting surface, the EMI clip lies flat against both the top and bottom sides of the mounting surface.
An EMI shielding device comprising:
An EMI clip retaining system comprising:
An EMI clip retaining system comprising:
An EMI clip retaining system comprising:
An EMI clip retaining system comprising:
An EMI shielding device comprising:
Dependencies are inferred from the claim text.