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US 6,638,864 B2Granted
Method for removing resist material
AssigneeNitto Denko Corporation
InventorsEiji Toyoda, Haruo Ioka
Life of this patent
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Abstract
The invention provides a method for removing a resist material existing on an article by adhering a pressure-sensitive adhesive sheet onto the surface of a resist material and releasing both the pressure-sensitive adhesive sheet and the resist material in an integrated state to thereby remove the resist material from the article, in which method the resist material has a Young's modulus of 0.5 MPa or more upon releasing.
Claims10
A method for removing resist material, which comprises:
- adhering a pressure-sensitive adhesive sheet onto an upper surface of a resist material, the resist material existing on an article;
- and
- releasing the pressure-sensitive adhesive sheet and the resist material at the same time so as to remove the resist material from the article;
- wherein the resist material has a Young's modulus of 0.5 MPa or more upon releasing, and
- the resist material has a tensile elongation at break of 30% or more upon releasing.
2 more elements
Dependencies are inferred from the claim text.