Method and apparatus for reduced flash encapsulation of microelectronic devices

A support member for supporting a microelectronic device in a mold, comprising a support member body having:

• a first surface configured to engage the microelectronic device;
• a second surface facing opposite the first surface;
• electrically conductive material at the first and/or second surface and/or between the first and second surfaces;
• a first edge between the first and second surfaces configured to engage an interior wall of the mold;
• a second edge between the first and second surfaces facing opposite the first edge;
• a plurality of index holes between the first and second edges;
• and
• an engaging surface extending between the first and second surfaces configured to engage an aligning member of the mold, the engaging surface spaced apart from the first edge by a selected distance having a tolerance range.

A support member for supporting a microelectronic device in a mold, comprising a support member body having:

• a first surface configured to engage the microelectronic device;
• a second surface facing opposite the first surface;
• electrically conductive material at least proximate to at least one of the first and second surfaces;
• a first edge between the first and second surfaces configured to engage an interior portion of the mold;
• a second edge between the first and second surfaces facing opposite the first edge;
• and
• a contact surface configured to contact an aligning member of the mold, the contact surface being spaced apart from the first edge by a selected distance having a tolerance range or ±50 microns or less.