Composite fins for heat sinks

A heat sink for dissipating thermal energy from an electronic device, the heat sink comprising:

• a copper base thermally coupled to the electronic device;
• a fin thermally coupled to the base, the fin comprising a copper portion and an aluminum portion such that the copper portion of the fin conducts thermal energy away from the copper base to the aluminum portion of the fin;
• and
• wherein at least one of the copper and aluminum portions includes louvers.

A method of assembling a heat sink, the method comprising:

• thermally coupling a first portion made from one material to a second portion made from a second material to form a fin, wherein thermally coupling a first portion to a second portion to form a fin includes crimping the first portion to the second portion;
• thermally coupling the fin to a base to form a heat sink;
• and
• thermally coupling the heat sink to an integrated circuit such that the heat sink conducts thermal energy away from the integrated circuit during operation of the integrated circuit.

A method of assembling a heat sink, the method comprising:

• thermally coupling a first portion made from one material to a second portion made from a second material to form a fin;
• thermally coupling the fin to a base to form a heat sink;
• thermally coupling the heat sink to an integrated circuit such that the heat sink conducts thermal energy away from the integrated circuit during operation of the integrated circuit;
• and
• forming louvers on the heat sink.

A kit of parts for forming a heat sink that is used to cool an electronic device, the kit comprising:

• a base adapted to be thermally coupled to the electronic device;
• a first portion adapted to by thermally coupled to the base;
• a second portion adapted to be thermally coupled to the first portion to form a fin, the second portion conducting thermal energy away from the first portion of the fin when the assembled fin is mounted to the base;
• and
• wherein at least one of the first and second portions of the kit includes louvers.

A computer system comprising:

• a chassis;
• an integrated circuit board mounted in the chassis;
• a processor coupled to the integrated circuit board;
• a heat sink thermally coupled to the processor, the heat sink comprising a base away from the processor, and a fin thermally coupled to the base, the fin comprising a first portion made from a first material and a second portion made from a second material;
• and
• wherein at least one of the first and second portions includes louvers.

A method of assembling a heat sink, the method comprising:

• thermally coupling one edge of a first portion made from one material to an opposing edge of a second portion made from a second material to form a fin;
• thermally coupling the fin to a base to form a heat sink;
• and
• thermally coupling the heat sink to an integrated circuit such that the heat sink conducts thermal energy away from the integrated circuit during operation of the integrated circuits wherein thermally coupling a first portion to a second portion to form a fin includes crimping the edge of the first portion to the opposing edge of the second portion.

A method of assembling a heat sink, the method comprising:

• thermally coupling one edge of a first portion made from one material to an opposing edge of a second portion made from a second material to form a fin;
• thermally coupling the fin to a base to form a heat sink;
• and
• thermally coupling the heat sink to an integrated circuit such that the heat sink conducts thermal energy away from the integrated circuit during operation of the integrated circuit wherein thermally coupling one edge of a first portion made from one material to an opposing edge of a second portion made from a second material to form a fin includes interleaving J-shaped edges.