Angled edge connections for multichip structures
AssigneeMicron Technology, Inc.
InventorPaul A. Farrar
Life of this patent
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Abstract
A multichip module that utilizes an angled interconnect to electrically interconnect chips in the module that are positioned at an angle relative to each other. The multichip module may comprise a first and second chips that are positioned in an orthogonal manner. The first and second chips are electrically interconnected via an interconnect structure comprising a first conductive pillar that extends from an outer surface of the first chip. A distal end of the first pillar is electrically connected to an outer surface of the second chip via a solder ball or another conductive pillar that is interposed between the distal end of the first conductive pillar and the second chip.
Claims9
A multichip module, comprising:
- a plurality of semiconductor chips stacked and secured together to form a base structure wherein the base structure has a first and a second lateral face, wherein each lateral face is comprised of a portion of each chip, wherein the first lateral face is adjacent to and substantially perpendicular to the second lateral face;
- a first exterior semiconductor chip mounted to the first lateral face of the base structure in a manner such that a first surface of the first exterior chip is positioned adjacent to the first lateral face and extends across at least a portion of the first lateral face;
- a second exterior semiconductor chip mounted to the second lateral face of the base structure in a manner such that a first surface of the second exterior chip is positioned adjacent to the second lateral face and extends across at least a portion of the second lateral face;
- and
- a connecting member that is adapted to electrically interconnect the first and second exterior chips, wherein the connecting member comprises a first distal end positioned adjacent to the first surface of the first exterior chip and electrically connected thereto and a second distal end positioned adjacent to the first surface of the second exterior chip and electrically connected thereto.
Dependencies are inferred from the claim text.