Micro-electromechanical actuator and methods of use

A micro-electromechanical actuator manufactured into a substrate, said actuator comprising:

• a first electrode;
• a second electrode operably secured to said substrate;
• a serpentine-shaped linkage operably secured to said first electrode and said substrate, said serpentine-shaped linkage having five spaced apart beams aligned substantially parallel with each other and operably secured together with spacer portions defining a neutral position,
• said first electrode and said second electrode are spaced apart from each other in said neutral position and said linkage moves to allow said first electrode to contact said second electrode when a voltage at or above a defined level is applied to the first and second electrodes;
• and,
• said first electrode is a beam aligned substantially parallel to said five beams in said neutral position;
• and,
• wherein said first electrode and said second electrode are spaced apart from each other in said neutral position and said linkage moves to allow said first electrode to contact said second electrode when a voltage at or above a defined level is applied to the first and second electrodes.

A micro-electromechanical actuator manufactured into a single crystal silicon wafer, said actuator comprising:

• a first electrode;
• a second electrode operably secured to said silicon wafer;
• a linkage operably secured to said first electrode and said silicon wafer and having a neutral position;
• wherein said first electrode and said second electrode are spaced apart from each other in said neutral position and said linkage moves to allow said first electrode to contact said second electrode when a voltage at or above a defined level is applied to the first and second electrodes;
• and,
• wherein, said micro-electromechanical actuator Is formed on a scribe fine on said silicon wafer.

A micro-electromechanical actuator manufactured into a substrate, said actuator comprising:

• a first electrode;
• a second electrode operably secured to said substrate;
• a linkage operably secured to said first electrode and said substrate and having a neutral position;
• wherein said first electrode and said second electrode are spaced apart from each other in said neutral position and said linkage moves to allow said first electrode to contact said second electrode when a voltage at or above a defined level is applied to the first and second electrodes;
• means for connecting a voltage generator to said first and second electrodes;
• and,
• a resistor electrically secured in series to said first electrode.

A testing device for determining if a plurality of spaced-apart micro-mechanical or micro-electromechanical devices formed using a flexible substrate have been manufactured within acceptable manufacturing tolerances, said testing device including:

• a linkage formed of said substrate and spaced apart from the plurality of devices, said linkage having a neutral position;
• a first electrode secured to said linkage;
• and,
• a second electrode operably secured to said substrate;
• wherein said first electrode and said second electrode are spaced apart from each other in said neutral position and said linkage moves to allow said first electrode to contact said second electrode when a voltage at a defined level is applied to the first and second electrodes, said defined level of voltage being proportional to the shape of the linkage for a given flexibility of the substrate such that if said shape of the linkage or said flexibility of said substrate is out of acceptable tolerance, said first electrode will not contact said second electrode when said defined level of voltage is applied to said first and second electrodes.

A testing device for determining if micro-mechanical and micro-electromechanical devices formed using a flexible substrate have been manufactured within acceptable manufacturing tolerances, said device including:

• a linkage operably secured to said substrate and having a neutral position;
• a first electrode secured to said linkage;
• a second electrode operably secured to said substrate;
• a handle wafer aligned substantially parallel to said substrate and operably secured to said substrate with a bonding layer extending between said handle wafer and said substrate;
• said first electrode secured to said handle wafer by a first portion of said bonding layer, and said linkage is secured to said handle wafer by a second portion of said bonding layer;
• and,
• wherein said first electrode and said second electrode are spaced apart from each other in said neutral position and said linkage moves to allow said first electrode to contact said second electrode when a voltage at a defined level is applied to the first and second electrodes, said defined level of voltage being proportional to the shape of the linkage for a given flexibility of the substrate such that if said shape of the linkage or said flexibility of said substrate is out of acceptable tolerance, said first electrode will not contact said second electrode when said defined level of voltage is applied to said first and second electrodes.