Metallizing method for dielectrics
AssigneeInfineon Technologies AG
InventorsJoerg Haussmann, Klaus Lowack, Wolfgang Radlik, Guenter Schmid, Recai Sezi
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Abstract
A method for metallizing dielectrics includes applying a photosensitive dielectric to a substrate. The dielectric is then exposed to light through a mask, is seeded with a metal and is subjected to a temperature treatment. Afterwards, the dielectric is chemically metallized. Alternatively, the dielectric can be first be seeded with a metal after being applied to the substrate, and can then be exposed to light through a mask. Afterwards, excess seeding material is removed and the dielectric is chemically metallized.
Claims7
A method for metallizing dielectrics, which comprises:
- applying a photosensitive dielectric to a substrate, said photosensitive dielectric being a photostructurable polymer;
- performing a process sequence selected from the group consisting of a first process sequence and a second process sequence,
- the first process sequence including exposing the photostructurable polymer to light through a mask, seeding the photostructurable polymer with a metal, and subjecting the photostructurable polymer to a thermal treatment, and
- the second process sequence including seeding the photostructurable polymer with a metal, exposing the photostructurable polymer to light through a mask and removing excess seeding material;
- and
- subsequently chemically metallizing the photostructurable polymer.
Dependencies are inferred from the claim text.