Method of defining and forming membrane regions in a substrate for stencil or membrane marks
AssigneeInternational Business Machines Corporation
InventorMichael J. Lercel
Life of this patent
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Abstract
A method and structure for forming subfield regions includes mechanical definition of the substrate through machining or mold forming. The subfield regions are filled with a sacrificial layer before the thin membranes are deposited. Slots are mechanically machined through a substrate (the slots have dimensions of membrane subfields) and filled with a sacrificial material. The substrate is planarized. A membrane material is deposited over the substrate and patterned. The sacrificial layer is then removed. A mold can be utilized to form the slotted substrate in place of the machining operation.
Claims39
A method of forming a mask comprising:
- mechanically machining slots through a substrate, wherein said slots have dimensions of membrane subfields;
- filling said slots with a sacrificial material;
- planarizing said substrate;
- depositing a membrane material over said substrate;
- patterning said membrane material;
- and
- removing said sacrificial material.
A method of forming a mask comprising:
- forming a mold in a shape complementary to a slotted substrate, wherein said slotted substrate includes slots having dimensions of membrane subfields;
- filling said mold with a substrate material to form said slotted substrate;
- removing said slotted substrate from said mold;
- filling said slots with a sacrificial material;
- planarizing said slotted substrate;
- depositing a membrane material over said slotted substrate;
- patterning said membrane material;
- and
- removing said sacrificial material.
A method of forming a lithographic mask comprising:
- providing a slotted substrate having slots;
- depositing a sacrificial material in said slots, wherein said sacrificial material fills at least a portion of said slots;
- planarizing said substrate such that said substrate and said sacrificial material form a continuous surface;
- depositing a lithographic mask material on said substrate;
- patterning said lithographic mask material;
- and
- removing said sacrificial material,
- wherein said sacrificial material provides support for said lithographic mask material during said depositing and said patterning said lithographic mask material.
A method of forming a lithographic mask comprising:
- depositing a lithographic mask material on a sacrificial material;
- machining slots in a substrate;
- attaching said lithographic mask material to said substrate;
- removing said sacrificial material;
- and
- patterning said lithographic mask material,
- wherein said sacrificial material provides support for said lithographic mask material during said attaching.
A method of forming a lithographic mask comprising:
- depositing a lithographic mask material on a sacrificial material;
- providing a mold having a complementary shape to a slotted substrate, wherein said slotted substrate includes slots;
- depositing a substrate material in said mold to form said slotted substrate;
- removing said slotted substrate from said mold;
- attaching said sacrificial material to said slotted substrate;
- removing said sacrificial material;
- and
- patterning said lithographic mask material.
A method of forming a lithographic mask comprising:
- depositing a lithographic mask material on a sacrificial material;
- attaching said lithographic mask material to a slotted substrate;
- removing said sacrificial material;
- and
- patterning said lithographic mask material,
- wherein said sacrificial material provides support for said lithographic mask material during said attaching.
Dependencies are inferred from the claim text.