Substrate processing method and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsTakayuki Toshima, Takehiko Orii
Life of this patent
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Abstract
On the occasion of developing processing, a mixed solution produced by stirring a developing solution and a solution with a specific gravity smaller than the developing solution is supplied to the front surface of a substrate and left as it is for a fixed period of time. After the mixed solution is separated into two layers of which the lower layer is the developing solution and the upper layer is the solution, developing progresses all at once in the entire surface of the substrate. Hence, time difference in start time of developing does not occur in the surface of the substrate, thereby enabling uniform developing and an improvement in line width uniformity of a resist pattern film in the surface of the substrate.
Claims18
A substrate processing apparatus, comprising:
- a holder for holding a substrate;
- and
- a nozzle for supplying a mixed solution of a first solution and a second solution, with the second solution having a specific gravity smaller than the first solution, onto the held substrate.
A substrate processing apparatus, comprising:
- a mounting table on which a substrate on which an exposure pattern is formed after a chemically amplified resist film is exposed in accordance with a predetermined pattern is horizontally held with the exposure pattern facing upward;
- and
- a mixed solution storage vessel for stirring a developing solution and a first solution having a specific gravity smaller than the developing solution which are to be supplied to the substrate and storing them.
A substrate processing apparatus, comprising:
- a substrate holding mechanism for horizontally holding a substrate;
- a rotating mechanism for rotating the substrate in a horizontal plane;
- a processing solution supply nozzle moving along a direction, in which an outer edge portion and a central portion of the substrate are linked, to supply a processing solution onto the substrate while the substrate is being rotated by the rotating mechanism;
- and
- a rinse solution supply nozzle, disposed adjacent to the processing solution supply nozzle so as to be positioned in a spreading direction of the processing solution supplied onto the substrate, for supplying a rinse solution onto the substrate simultaneously with the supply of the processing solution.
A substrate processing apparatus, comprising:
- a holder for holding a substrate;
- a first nozzle for supplying a first solution onto the held substrate;
- a second nozzle for supplying a gas onto the held substrate;
- and
- a moving mechanism for moving a supply position of the first nozzle and moving the second nozzle so that the first solution which has just been supplied from the first nozzle is removed by the gas supplied from the second nozzle;
- wherein the gas is an inert gas.
A substrate processing apparatus comprising:
- a holder for holding a substrate;
- a first nozzle for supplying a first solution onto the held substrate;
- a second nozzle for supplying a second solution onto the held substrate;
- and
- a moving mechanism for moving a supply position of the first nozzle and moving the second nozzle so that the first solution which has just been supplied from the first nozzle is removed by the second solution supplied from the second nozzle;
- wherein the first solution is a resist solution and the second solution is a solvent.
Dependencies are inferred from the claim text.