Snap-in heat sink for semiconductor mounting

A multiple heat sink assembly, said assembly comprising:

• a multiple frame having a plurality of individual sites, each site having a bottom surface and a plurality of spring members extending upwardly from said bottom surface, the plurality of spring members having free ends configured with projections thereon;
• an electronic component fitted within the spring members and located against the bottom surface;
• a heat sink having a generally planar surface in contact with the electronic component and having a plurality of heat radiating fins extending outwardly from the planar surface, the heat sink having at least one elongated ridge formed along at least two oppositely disposed exterior surfaces thereof;
• the heat sink retained in a fixed position with respect to the frame by means of the plurality of spring members snap-fittingly engaged about the elongated ridges;
• and
• a spring located intermediate the frame and the electronic component, the spring adapted to create a predetermined bias to force the electronic component outwardly against the generally planar surface of the heat sink.

A method of assembling a heat sink to contact an electronic component, said method comprising the steps of:

• providing a frame having a plurality of outwardly extending spring members having protrusions at the free ends thereon;
• providing a heat sink having lateral sides, each lateral side having an upper end defined by an elongated ridge;
• positioning a spring having a outer surface in the frame in a predetermined location;
• positioning an electronic component against the outer surface of the spring;
• and
• inserting the heat sink between the outwardly extending spring members to cause the protrusion to snap fit over the ridges in the heat sink to affix the heat sink to the frame in a position where the spring is compressed to create a force between the electronic component and the heat sink.