Heat-dissipating devices, systems, and methods with small footprint

An enhanced heat dissipation device comprising:

• a thermally conductive core, wherein the thermally conductive core has upper and lower outer surface areas;
• a first conductive ring having a first array of radially extending fins, the first array being thermally coupled to the upper outer surface area of the thermally conductive core;
• and
• a second conductive ring, thermally coupled to the lower outer surface area, wherein the first conductive ring has a first outer diameter, wherein the second conductive ring has a second outer diameter, and wherein the second outer diameter is less than the first outer diameter.

A heat dissipation system comprising:

• an integrated circuit device having a front side and a back side, wherein the front side is disposed across from the back side, wherein the front side is attached to a circuit board having components;
• and
• an enhanced heat dissipation device including
• a thermally conductive core attached to the back side of the integrated circuit device, the thermally conductive core having upper and lower core surface areas, wherein the upper and lower core surface areas have a first and second length;
• and
• a first conductive ring having a first plurality of folded fins, the first plurality of folded fins being thermally coupled to the upper core surface area, the first plurality of folded fins surrounding the upper core surface area, the first length of the first conductive ring being sufficient to permit components to be mounted on the circuit board and below the first conductive ring.

A heat dissipation system comprising:

• an integrated circuit device having a front side and a back side, wherein the front side is disposed across from the back side, and wherein the front side is attached to a circuit board having components;
• a heat dissipation device including
• a thermally conductive core attached to the back side of the integrated circuit device, the thermally conductive core having upper and lower core surface areas, wherein the upper and lower core surface areas have a first and second length;
• a first conductive ring having a first plurality of folded fins, the first plurality of folded fins being thermally coupled to the upper core surface area, the first plurality of folded fins surrounding the upper core surface area, the first length of the first conductive ring being sufficient to permit components to be mounted on the circuit board and below the first conductive ring, wherein the thermally conductive core further comprises a base, wherein the base is in close proximity to the lower core surface area, and wherein the base and the back side of the integrated circuit device have coinciding footprint sizes so that temperatures of the integrated circuit device, the base, the first plurality of folded fins, and the thermally conductive core are close to each other during operation to enhance heat transfer from the integrated circuit device;
• a second conductive ring having a second plurality of folded fins, the second plurality of folded fins being thermally coupled to the lower core surface area, the second conductive ring having a second diameter, the first conductive ring having a first diameter, wherein the second diameter is less than the first diameter and is sufficient to permit components to be mounted on the circuit board and below the first conductive ring;
• and
• a heat transport medium, wherein the thermally conductive core further has a top surface disposed across from the base and in close proximity to the upper core surface area, and wherein the heat transport medium is attached to the top surface such that a direction of flow of a cooling medium introduced by the heat transport medium over the first plurality of folded fins enhances heat extraction from the integrated circuit device.

A method of forming an enhanced heat dissipation device to extract heat from an integrated circuit device mounted on an assembled printed circuit board comprising:

• forming a thermally conductive core having upper and lower core surface areas;
• forming a first array of radially extending fins;
• forming a first conductive ring from the formed first array, wherein the first conductive ring has a first diameter;
• and
• attaching the first conductive ring to the upper core surface area such that the lower core surface area has sufficient space below the first conductive ring to allow components to encroach around the integrated circuit device when mounted onto the integrated circuit device.

A method of forming an enhanced heat dissipation device to extract heat from an integrated circuit device mounted on an assembled printed circuit board comprising:

• forming a thermally conductive core having upper and lower core surface areas;
• forming a first array of radially extending fins;
• forming a first conductive ring from the formed first array, wherein the first conductive ring has a first diameter;
• attaching the first conductive ring to the upper core surface area such that the lower core surface area has sufficient space below the first conductive ring to allow components to encroach around the integrated circuit device when mounted onto the integrated circuit device;
• forming a second array of radially extending fins;
• forming a second conductive ring from the formed second array, wherein the second conductive ring has a second diameter, wherein the second diameter is less than about half the first diameter;
• and
• attaching the second conductive ring to the lower core surface area such that the second diameter is of sufficient size to allow the components to encroach around the integrated circuit device and below the first conductive ring.