Personalized circuit module package and method for packaging circuit modules
AssigneeAmkor Technology, Inc.
InventorsPaul Robert Hoffman, John Armando Miranda
Life of this patent
Estimating the term…
Abstract
A personalized circuit module package and method for packaging circuit modules provides graphical packaging for memory modules and other circuit modules. A removable housing is attached to a circuit module containing one or more integrated circuits bonded to a carrier and covered with an encapsulant. Graphics may be printed on the removable housing, or may be printed on an insert that is either inserted into a pocket within the removable housing, or is inserted between a removable housing having a window and the circuit module. Alternatively, the housing itself may be used to personalize the circuit module, by providing a colored or textured removable housing for the circuit module.
Claims20
A circuit module, comprising:
- at least one integrated circuit for providing an electronic function of the circuit module;
- a carrier for mounting the at least one integrated circuit within the circuit module;
- an encapsulation containing the at least one integrated circuit on top of the carrier;
- and
- a detachable housing not chemically bonded to the encapsulation or carrier for covering the encapsulation.
A circuit module, comprising:
- at least one integrated circuit for providing an electronic function of the circuit module;
- a carrier for mounting the at least one integrated circuit within the circuit module;
- an encapsulation containing the at least one integrated circuit on top of the carrier;
- and
- means for detachably covering the encapsulation, whereby the covering means is not chemically bonded to the encapsulation or carrier.
A removable housing adapted for attachment to a circuit module, wherein the removable housing comprises:
- a top portion;
- and
- a substantially rectangular frame portion disposed around the edges of the top portion for detachably coupling the top portion to the circuit module, whereby the housing can be attached to a circuit module without chemical bonding.
Dependencies are inferred from the claim text.