Micro-ball grid array package tape including tap for testing
AssigneeSamsung Electronics Co., Ltd.
InventorYoon-Gyu Song
Life of this patent
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Abstract
A package tape for testing a chip assembled by a packaging method such as a micro-ball grid array (BGA) package, whereby the chip is designed to face downward. The package tape includes one or more taps, disposed on a guard area other than an area where a semiconductor chip is attached, for testing the semiconductor chip. One or more pads are disposed on the area where the semiconductor chip is attached and are attached to corresponding test pads on the semiconductor chip. One or more leads which electrically connect the taps with the pads. The package tape advantageously enables easy testing of the electric characteristics of the semiconductor chip, which in a typical BGA package tape cannot be tested by probing since the circuit thereof faces down.
Claims20
A micro-ball grid array (BGA) package tape comprising:
- an insulating film, having a top surface, said top surface including,
- a first area, adapted for a semiconductor chip to be attached thereto, and
- a guard area at the periphery of the first area;
- one or more taps, disposed on the guard area on the top surface of the insulating film, for testing the semiconductor chip;
- one or more pads, disposed on the first area on the top surface of the insulating film, said pads being attached to corresponding test pads on the semiconductor chip;
- and
- one or more leads which electrically connect the taps with the pads.
A semiconductor device package tape comprising:
- an insulating film, having a top surface, said top surface including,
- a first area, adapted for a semiconductor chip to be attached thereto, and
- a second area at the periphery of the first area;
- at least one pad disposed at the first area on the top surface of the insulating film;
- a semiconductor chip adhered to the insulating film at the first area, the at least one pad being electrically connected to at least one corresponding test pad of the semiconductor chip;
- at least one tap disposed at the second area on the top surface of the insulating film;
- and
- at least one lead formed on the insulating film to electrically connect the at least one pad and the at least one tap.
Dependencies are inferred from the claim text.