Microelectronic fabrication tool loading method providing enhanced microelectronic fabrication tool operating efficiency
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYiau-Hweui Chen, Kerry Chiu, Raymond Chen, Larry Huang
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Abstract
Within a method for operating a fabrication tool which requires transfer of a series substrates from a storage carrier to a process carrier when fabricating the series of substrates within the process carrier within the fabrication tool, a specific series of substrates is transferred from a storage carrier to a process carrier (and/or the reverse) simultaneously with fabricating a separate series of substrates within a process carrier within the fabrication tool. By employing the method, the fabrication tool may be operated more efficiently.
Claims17
A method for operating a fabrication tool comprising:
- providing a fabrication tool which requires transfer of a lot of substrates from a storage carrier to a process carrier when fabricating the lot of substrates within the process carrier within the fabrication tool, the fabrication tool having associated therewith a transfer apparatus for transfer of the lot of substrates from the storage carrier to the process carrier and an input/output station for receiving the storage carrier and positioning the same with respect to the transfer apparatus;
- providing a first lot of substrates within a first storage carrier upon the input/output station;
- transferring, while employing the transfer apparatus, the first lot of substrates from the first storage cater to a first process carrier, removing the emptied first storage carrier from the input/output station and storing the same in a storage facility provided external to the fabrication tool;
- processing, for a first process time interval, the first lot of substrates within the first process carrier within the fabrication tool while:
- providing a second lot of substrates within a second storage carrier upon the input/output station;
- transferring, while employing the transfer apparatus, the second lot of substrates from the second storage carrier to a second process carrier;
- and
- removing the emptied second storage carrier from the input/output station and storing the same in the storage facility provided external to the fabrication tool.
A method for operating a fabrication tool comprising:
- providing a fabrication tool which requires transfer of a lot of semiconductor substrates from a storage carrier to a process carrier when fabricating the lot of semiconductor substrates within the process carrier within the fabrication tool, the fabrication tool having associated therewith a transfer apparatus for transfer of the lot of semiconductor substrates from the storage carrier to the process carrier and an input/output station for receiving the storage carrier and positioning the same with respect to the transfer apparatus;
- providing a first lot of semiconductor substrates within a first storage carrier upon the input/output station;
- transferring, while employing the transfer apparatus, the first lot of semiconductor substrates from the first storage carrier to a first process carrier, removing the first storage carrier from the input/output station and storing the same in a storage facility provided external to the fabrication tool;
- processing, for a first process time interval, the first lot of semiconductor substrates within the first process carrier within the fabrication tool while:
- providing a second lot of semiconductor substrates within a second storage carrier upon the input/output station;
- transferring, while employing the transfer apparatus, the second lot of semiconductor substrates from the second storage carrier to a second process carrier;
- and
- removing the emptied second storage carrier from the input/output station and storing the same in the storage facility provided external to the fabrication tool.
Dependencies are inferred from the claim text.