Back to results
US 6,618,250 B2Granted
Modular electronics enclosure
AssigneeEricsson Inc.
InventorEdwin John Nealis
Life of this patent
Estimating the term…
Abstract
An electronics enclosure includes a mounting bracket adapted to mount to a support structure, a heat absorption module adapted to mount to the mounting bracket, and a housing to contain electronic equipment. The housing is adapted to mount alternatively to either the mounting bracket or the heat absorption module dependent upon solar loading conditions.
Claims26
An electronics enclosure comprising:
- a mounting bracket adapted to mount to a support structure;
- a heat absorption module acting as a heat sink adapted to mount to the mounting bracket;
- and
- a housing containing electronic circuitry comprising electronic components and adapted to mount alternatively to either the mounting bracket or the heat absorption module.
1 more element
A method of installing an electronics enclosure comprising:
- providing a mounting bracket adapted to mount to an electronics housing comprising a plurality of electronic components and a heat absorption module acting as a heat sink;
- when the electronics housing is subject to solar loading, mounting the heat absorption module to the mounting bracket;
- when the electronics housing is subject to solar loading, mounting the electronics housing to the heat absorption module such that the heat absorption module is disposed between the mounting bracket and the electronics housing;
- and
- when the electronics housing is not subject to solar loading, mounting the electronics housing directly to mounting bracket without the heat absorption module.
2 more elements
Dependencies are inferred from the claim text.