Devices and methods for compensating for tilting of a leveling table in a microlithography apparatus
AssigneeNikon Corporation
InventorToshio Ueta
Life of this patent
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AssigneeNikon Corporation
InventorToshio Ueta
Estimating the term…
With respect to exposure apparatus, apparatus and methods are disclosed for compensating for lateral shift of a leveling table caused by a tilt (θ) of the leveling table. One embodiment includes a wafer-stage-position loop servo, a leveling-table tilt-position loop servo, and a first feed-forward loop from the leveling-table tilt-position loop servo to the wafer-stage-position loop servo. The first feed-forward loop converts a torque-control signal for the leveling table to a linear-acceleration-control signal for the wafer stage. Thus, the wafer stage moves laterally to compensate for lateral shift of the leveling table. If the exposure apparatus includes a reticle stage controlled by a reticle-stage-position loop servo, then the subject apparatus can include (in addition to or in place of the first feed-forward loop) a second feed-forward loop from the leveling-table tilt-position loop servo to the reticle-stage-position loop servo. The second feed-forward loop converts a positional signal for the leveling table to a position-control signal for the reticle stage, to cause the reticle stage to undergo lateral compensatory motion. The methods and apparatus provide a faster and more accurate compensation for lateral shifts of the leveling table.
In an exposure apparatus including a wafer stage movable at least in X- and Y-directions and a leveling table tiltable relative to a Z-axis that is perpendicular to the X- and Y-directions, a control system hat compensates for lateral shift of the leveling table caused by a tilt (θ) of the leveling table, the control system comprising:
In an exposure apparatus including a wafer stage movable at least in X- and Y-directions, a leveling table tiltable relative to a Z-axis that is perpendicular to the X-and Y-directions, and a reticle stage movable at least in the X- and Y-directions, a control system for compensating for lateral shift of the leveling table caused by a tilt (θ) of the leveling table, the control system comprising:
An exposure apparatus, comprising:
An exposure apparatus, comprising:
In an exposure method in which a substrate, mounted on a wafer stage movable at least in mutually perpendicular X- and Y-axis directions, is exposed to a pattern defined by a reticle, a method for maintaining an alignment of the substrate for exposure, the method comprising:
In an exposure method in which a substrate, mounted on a wafer stage movable at least in mutually perpendicular X- and Y-axis directions, is exposed to a pattern defined by a reticle mounted on a reticle stage, a method for maintaining an alignment of the substrate for exposure, the method comprising:
A positioning apparatus for positioning a substrate, comprising:
A positioning apparatus that positions a substrate, comprising:
In an exposure apparatus including a reticle stage movable at least in X- and Y-directions, a wafer stage movable at least in X- and Y-directions, a leveling table associated with the wafer stage and tiltable relative to a Z-axis that is perpendicular to the X- and Y-directions, and a control system that compensates for lateral shift of the leveling table caused by a tilt (θ) of the leveling table, the control system comprising:
An exposure apparatus, comprising:
Dependencies are inferred from the claim text.