Semiconductor device and method of isolating circuit regions
OwnerRobert B. Daviesinventor
Life of this patent
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Abstract
A semiconductor device (10) includes a semiconductor die (14) having first and second circuit regions (30, 32) formed on a first surface (24). The semiconductor die is housed in a semiconductor package (20) whose lid (40) is formed with a projection (67) that electrically contacts the first surface of the semiconductor die to shield the first circuit region from the second circuit region. Also, inactive components, such as a capacitor can be formed in lid (40).
Claims31
A semiconductor device, comprising:
- a semiconductor die having first and second circuit regions formed on a first surface;
- and
- a semiconductor package for housing the semiconductor die, the semiconductor package including a lid formed with a projection and electrically conductive material, said projection physically contacting the semiconductor die, the projection electrically shielding the first circuit region from the second circuit region.
An integrated circuit, comprising:
- a first semiconductor die having a first surface for forming a first circuit component;
- a second semiconductor die having a first surface for forming a second circuit component;
- and
- an integrated circuit package having a lid formed with a projection, said projection physically and electrically contacting the first surface of the first semiconductor die to electrically isolate the first circuit component from the second circuit component.
A method of electrically isolating a region of a semiconductor die, comprising the steps of:
- providing a semiconductor package for housing the semiconductor die;
- generating a radiating signal with a circuit component of the semiconductor die;
- and
- shielding the radiating signal with a projection formed in a lid of the semiconductor package;
- said projection of said lid physically contacting the semiconductor die.
A method of making an integrated circuit, comprising the steps of:
- mounting a first surface of a semiconductor die to a package base of a semiconductor package;
- and
- enclosing the semiconductor die with a lid of the semiconductor package, where the lid is formed with a projection for physically and electrically contacting a second surface of the semiconductor die.
A method of using an integrated circuit, comprising the steps of:
- providing a semiconductor die;
- providing a semiconductor package and housing the semiconductor die in the semiconductor package, the semiconductor package including a lid formed to provide electrical shielding for the semiconductor die, said projection physically contacting the semiconductor die, the lid including a conductive area, and a capacitor including a dielectric layer positioned on the conductive area of the lid and a conductive layer positioned on the dielectric layer, the conductive layer having a plurality of electrical contacts;
- and
- positioning a first of the electrical contacts for coupling to a power source and coupling remaining electrical contacts to power input terminals on the semiconductor die, for using the conductive layer to distribute power to different points on the semiconductor die.
Dependencies are inferred from the claim text.