Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink
AssigneeThermagon, Inc.
InventorsRichard F. Hill, Jason L. Strader
Life of this patent
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Abstract
A multi-layer solid structure and method for forming a thermal interface between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0.03° C.-in2/W at a pressure of less than 100 psi. The structure comprises at least two metallic layers each of high thermal conductivity with one of the two layers having phase change properties for establishing low thermal resistance at the interface junction between the microelectronic component package and the heat sink.
Claims5
A free standing multi-layer solid metallic thermal interface structure for placement at the interface between a microelectronic component package and a heat sink so as to provide a total thermal resistance of no greater than about 0.03° C.-in2/W comprising at least two solid metallic layers of high thermal conductivity superimposed upon one another to form a sandwich in cross section with one of the two solid metallic layers having phase change properties and a thickness of less than about 2 mils and wherein the surface area of the interface structure is larger than the surface area of the microelectronic component package and/or heat sink such that the perimeter of said free standing thermal interface structure extends from the microelectronic component package and/or heat sink to form an exposed border area surrounding the microelectronic component package and/or heat sink.
Dependencies are inferred from the claim text.