Method of reflowing organic packages using no-clean flux
AssigneeAdvanced Micro Devices, Inc.
InventorsRaj N. Master, Mohammad Z. Khan, Maria G. Guardado
Life of this patent
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Abstract
A method of manufacturing a semiconductor device by attaching a flip chip die to an organic substrate using solder comprises applying no-clean flux to the flip chip die or the organic substrate; heating the flip chip die and the organic substrate to bond the flip chip die to the organic substrate, and cooling the flip chip die and the organic substrate. The step of heating the flux includes controlling oxygen and moisture content of an atmosphere surrounding the flux, preheating to a temperature of about 145° C. to about 165° C., soaking at a temperature of about 145° C. to about 165° C. for about four to about six minutes, and reflowing above the solder's melting point.
Claims14
A method of manufacturing a semiconductor device by attaching a die to an organic substrate using solder, comprising the steps of:
- a) applying flux to one of the die and the organic substrate;
- b) heating the die and the substrate to bond the die to the organic substrate, the step of heating includes preheating to a temperature of about 145° C. to about 165° C., soaking at a temperature of about 145° C. to about 165° C. for about four to about six minutes, and reflowing at a temperature above the solder's melting point;
- and
- c) cooling the die and the organic substrate.
A method of manufacturing a semiconductor device by attaching a die to an organic substrate using solder, comprising the steps of:
- a) applying no-clean flux to one of the die and the organic substrate;
- b) heating the die and the organic substrate to bond the die to the organic substrate, the step of heating includes controlling oxygen and moisture content of an atmosphere surrounding the flux, preheating to a temperature of about 145° C. to about 165° C., soaking at a temperature of about 145° C. to about 165° C. for about four to about six minutes, and reflowing at a temperature above the solder's melting point;
- c) cooling the die and the organic substrate;
- and
- d) underfilling between the die and the organic substrate.
Dependencies are inferred from the claim text.