Method of producing an integrated circuit configuration

A method of producing an integrated circuit configuration, the method which comprises:

• forming trenches surrounding active regions in a main surface of a semiconductor substrate;
• applying a photoresist layer on an insulating layer and structuring the applied photoresist layer to form a mask using a data processing device programmed to perform the following steps:
• providing an idealized pattern representing trenches formed in the semiconductor substrate and having contours which correspond to contours of the trenches and having idealized active regions which represent the active regions in the semiconductor substrate;
• producing an idealized mask pattern on the basis of the idealized pattern containing rectilinear contours which are shifted by an allowance in comparison with the idealized pattern, the allowance starting on that side of the idealized active regions which is respectively remote therefrom, the idealized mask pattern having surface zones defined therein which are bounded by the rectilinear contours whose distance apart is shorter than a given minimum measurement;
• and
• using the idealized mask pattern to produce a further idealized mask pattern in which the surface zones are replaced by minimum surface elements having length measurements which are greater than the given minimum measurement where a surface of the minimum surface elements essentially corresponds to a surface of the surface zone which the minimum surface elements are replacing, and where the mask is formed from the further idealized mask pattern;
• and
• filling the trenches by depositing an insulating layer using the formed mask.