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US 6,616,526 B2Granted
Clean room and method for fabricating semiconductor device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTakahiro Matsuura, Haruo Nakase
Life of this patent
Estimating the term…
Abstract
The clean room of this invention includes a first clean region in which a semiconductor substrate to be set in a fabrication system is disposed and a second clean region adjacent to the first clean region in which an operator is disposed. A first air flow flowing downward is introduced into the first clean region and a second air flow flowing downward is introduced into the second clean region. The rate of the first air flow is higher than the rate of the second air flow.
Claims13
A clean room comprising:
- a first clean region in which a semiconductor substrate or a cassette to be set in a fabrication system is disposed, and in which a first air flow flowing downward is introduced;
- a second clean region adjacent to said first clean region, and in which an operator is disposed and a second air flow flowing downward is introduced;
- and
- partition means disposed between said first clean region and said second clean region for separating said first air flow from said second air flow,
- wherein a rate of said first air flow is higher than a rate of said second air flow.
2 more elements
A method for fabricating a semiconductor
- device comprising a step of setting a semiconductor substrate in a fabrication system through an operation of an operator in a clean room including a first clean region in which the semiconductor substrate or a cassette to be set in the fabrication system is disposed and in which a first air flow flowing downward is introduced, a second clean region adjacent to said first clean region, and in which an operator is disposed and a second air flow flowing downward is introduced, and partition means disposed between said first clean region and said second clean region for separating said first air flow from said second air flow,
- wherein a rate of said first air flow is higher than a rate of said second air flow.
A clean room comprising:
- a first clean region in which a semiconductor substrate or a cassette to be set in a fabrication system is disposed, and in which a first air flow flowing downward is introduced;
- a second clean region adjacent to said first clean region, and in which an operator is disposed and a second air flow flowing downward is introduced;
- partition means disposed between said first clean region and said second clean region for separating said first air flow from said second air flow,
- wherein said partition means has a four-plane structure having an upper opening and a lower opening,
- said upper opening has an area larger than said lower opening, and a rate of said first air flow is higher than a rate of said second air flow.
2 more elements
Dependencies are inferred from the claim text.