Apparatus and method for bond force control
AssigneeASM Assembly Automation Ltd.
InventorsSun Kuen Wong, Ming Yeung Luke Wan
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Abstract
An apparatus and method are disclosed for providing bond force in a die bonding operation. The apparatus comprises means such as a compression spring for generating a primary bond force, and additionally means such as a voice coil for generating a compensatory bond force. The compensatory bond force can be controlled by varying the current to the voice coil so as to add to or reduce the bond force whereby a bond force comprising the sum of the primary bond force and the compensatory bond force may be controlled.
Claims19
Apparatus for providing bond force in a die bonding operation, comprising means for generating a primary bond force, means for generating a compensatory bond force, and means for controlling the compensatory bond force whereby a bond force comprising the sum of the primary bond force and the compensatory bond force may be controlled.
An apparatus for providing a bond force along a bonding axis in a die bonding operation, comprising:
- a housing;
- a die holding means mounted in said housing for movement relative to said housing along said bonding axis;
- a primary bond force generator that generates a force which opposes movement of said die holding means relative to said housing in a first direction along said axis;
- and
- a compensatory bond force generator mounted in said housing that moves said die holding means bidirectionally relative to said housing along said axis.
A method of generating a desired bond force in a die bonding operation, comprising:
- providing a primary bond force, generating a compensatory bond force in the same direction or opposite to said primary bond force, summing said primary bond force and said compensatory bond force to generate said bond force, and controlling the magnitude and sign of said compensatory bond force to control said generated bond force.
A method of controlling the impact force in a die bonding operation, comprising moving a bond head bearing a die toward a substrate in a first direction, and providing means for generating a compensatory force in a direction opposite to said first direction at the moment of impact of said die on said substrate.
Dependencies are inferred from the claim text.