Advanced air cooled heat sink
AssigneeDelphi Technologies, Inc.
InventorsShrikant Mukund Joshi, Mohinder Singh Bhatti
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Abstract
A heat sink for cooling electrical or electronic devices comprises a base plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from a strip of heat conducting material includes alternating planar portions and curved portions has one edge abutted to the top surface such that the curved portions extend upwardly from the top surface substantially at a right angle. Each planar portion has a plurality of louvers formed therein wherein the louvers are substantially parallel one to the other and perpendicular to the base plate.
Claims13
A heat sink for cooling electrical or electronic devices, said heat sink comprising:
- a base plate having a top surface and having a bottom surface for attaching to the electronic device;
- and
- a folded fin formed from a strip of heat conducting material, said folded fin further comprising alternating planar portions and curved portions, wherein said folded fin has one edge abutted to said top surface such that said curved portions extend upwardly from said top surface substantially at a right angle, each of said planar portions having a plurality of louvers formed therein with said louvers being substantially parallel to one another and at least one of said curved portions including an end louver formed therein with said end louver formed as a door-like flap for defining an end passageway therethrough.
Dependencies are inferred from the claim text.