Cabinet for cooling electronic modules

A cabinet for cooling electronic modules, comprising:

• a plurality of outer surfaces comprising a first side surface, a second side surface, a front surface, a rear surface and a top surface substantially perpendicular to the first side surface, wherein the first side surface defines a plurality of side inlet orifices to enable cooling air to enter the cabinet, and wherein the top surface defines a plurality of top exhaust orifices to enable the cooling air to exit the cabinet;
• a plurality of chassis encompassed by the plurality of outer surfaces, wherein the plurality of chassis and the first side surface define a first interspace region, and wherein the plurality of chassis and the second side surface define a second interspace region;
• a plurality of electronic modules coupled to each of the plurality of chassis, wherein the plurality of electronic modules are substantially horizontally disposed within each of the plurality of chassis, and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each;
• and
• an air moving apparatus coupled to draw the cooling air external to the cabinet into the first interspace region, wherein the cooling air passes over the plurality of electronic modules in a substantially horizontal manner and substantially parallel to the front surface and the rear surface, wherein the cooling air subsequently enters the second interspace region and is thereafter exhausted from the cabinet, and wherein the cooling air removes at least 8,000 Watts of thermal energy from the cabinet.

A cabinet for cooling electronic modules, comprising:

• a plurality of outer surfaces comprising a first side surface, a second side surface, a front surface, a rear surface and a bottom surface substantially perpendicular to the first side surface, wherein the first side surface defines a plurality of side inlet orifices to enable cooling air to enter the cabinet, and wherein the bottom surface defines a plurality of bottom exhaust orifices to enable the cooling air to exit the cabinet;
• a plurality of chassis encompassed by the plurality of outer surfaces, wherein the plurality of chassis and the first side surface define a first interspace region, and wherein the plurality of chassis and the second side surface define a second interspace region;
• a plurality of electronic modules coupled to each of the plurality of chassis, wherein the plurality of electronic modules are substantially horizontally disposed within each of the plurality of chassis, and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each;
• and
• an air moving apparatus coupled to draw the cooling air external to the cabinet into the first interspace region, wherein the cooling air passes over the plurality of electronic modules in a substantially horizontal manner and substantially parallel to the front surface and the rear surface, wherein the cooling air subsequently enters the second interspace region and is thereafter exhausted from the cabinet, and wherein the cooling air removes at least 8,000 Watts of thermal energy from the cabinet.

A cabinet for cooling electronic modules, comprising:

• a plurality of outer surfaces comprising a first side surface, a second side surface, a front surface and a rear surface, wherein the front surface has a first front peripheral portion, a second front peripheral portion and a front central portion, wherein at least one of the first front peripheral portion and the second front peripheral portion define a plurality of front surface exhaust orifices to enable cooling air to exit the cabinet without substantially impinging on a front outward projection space of the front central portion;
• a plurality of chassis encompassed by the plurality of outer surfaces, wherein the plurality of chassis and the first side surface define a first interspace region, and wherein the plurality of chassis and the second side surface define a second interspace region;
• a plurality of electronic modules coupled to each of the plurality of chassis, wherein the plurality of electronic modules are substantially horizontally disposed within each of the plurality of chassis, and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each;
• and
• an air moving apparatus coupled to draw the cooling air external to the cabinet into the first interspace region, wherein the cooling air passes over the plurality of electronic modules in a substantially horizontal manner and substantially parallel to the front surface and the rear surface, wherein the cooling air subsequently enters the second interspace region and is thereafter exhausted from the cabinet, and wherein the cooling air removes at least 8,000 Watts of thermal energy from the cabinet.

A cabinet for cooling electronic modules, comprising:

• a plurality of outer surfaces comprising a first side surface, a second side surface, a front surface and a rear surface, wherein the rear surface has a first rear peripheral portion, a second rear peripheral portion and a rear central portion, wherein at least one of the first rear peripheral portion and the second rear peripheral portion define a plurality of rear surface exhaust orifices to enable cooling air to exit the cabinet without substantially impinging on an rear outward projection space of the rear central portion;
• a plurality of chassis encompassed by the plurality of outer surfaces, wherein the plurality of chassis and the first side surface define a first interspace region, and wherein the plurality of chassis and the second side surface define a second interspace region;
• a plurality of electronic modules coupled to each of the plurality of chassis, wherein the plurality of electronic modules are substantially horizontally disposed within each of the plurality of chassis, and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each;
• and
• an air moving apparatus coupled to draw the cooling air external to the cabinet into the first interspace region, wherein the cooling air passes over the plurality of electronic modules in a substantially horizontal manner and substantially parallel to the front surface and the rear surface, wherein the cooling air subsequently enters the second interspace region and is thereafter exhausted from the cabinet, and wherein the cooling air removes at least 8,000 Watts of thermal energy from the cabinet.

A method of cooling electronic modules in a cabinet, comprising:

• the cabinet including a first side surface, a second side surface, a front surface and a rear surface;
• providing a plurality of chassis inside of the cabinet, wherein the plurality of chassis and the first side surface define a first interspace region, and wherein the plurality of chassis and the second side surface define a second interspace region;
• providing a plurality of electronic modules coupled to each of the plurality of chassis, wherein the plurality of electronic modules are substantially horizontally disposed within each of the plurality of chassis, and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each;
• providing an air moving apparatus coupled draw cooling air into the cabinet;
• the air moving apparatus drawing the cooling air external to the cabinet into the first interspace region;
• the cooling air entering the cabinet through a plurality of side inlet orifices defined by the first side and the cooling air exiting the cabinet through a plurality of exhaust orifices defined by the second side surface;
• directing the cooling air over the plurality of electronic modules in a substantially horizontal manner and substantially parallel to the front surface and the rear surface;
• the cooling air subsequently entering the second interspace region;
• and
• exhausting the cooling air from the cabinet, wherein the cooling air removes at least 8,000 Watts of thermal energy from the cabinet.

A method of cooling electronic modules in a cabinet, comprising:

• the cabinet including a first side surface, a second side surface, a front surface, a rear surface and a top surface substantially perpendicular to the first side surface;
• providing a plurality of chassis inside of the cabinet, wherein the plurality of chassis and the first side surface define a first interspace region, and wherein the plurality of chassis and the second side surface define a second interspace region;
• providing a plurality of electronic modules coupled to each of the plurality of chassis, wherein the plurality of electronic modules are substantially horizontally disposed within each of the plurality of chassis, and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each;
• providing an air moving apparatus coupled draw cooling air into the cabinet;
• the air moving apparatus drawing the cooling air external to the cabinet into the first interspace region;
• the cooling air entering the cabinet through a plurality of side inlet orifices defined by the first side surface and exiting the cabinet through a plurality of top exhaust orifices defined by the top surface;
• directing the cooling air over the plurality of electronic modules in a substantially horizontal manner and substantially parallel to the front surface and the rear surface;
• the cooling air subsequently entering the second interspace region;
• and
• exhausting the cooling air from the cabinet, wherein the cooling air removes at least 8,000 Watts of thermal energy from the cabinet.

A method of cooling electronic modules in a cabinet, comprising:

• the cabinet including a first side surface, a second side surface, a front surface, a rear surface and a bottom surface substantially perpendicular to the first side surface;
• providing a plurality of chassis inside of the cabinet, wherein the plurality of chassis and the first side surface define a first interspace region, and wherein the plurality of chassis and the second side surface define a second interspace region;
• providing a plurality of electronic modules coupled to each of the plurality of chassis, wherein the plurality of electronic modules are substantially horizontally disposed within each of the plurality of chassis, and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each;
• providing an air moving apparatus coupled draw cooling air into the cabinet;
• the air moving apparatus drawing the cooling air external to the cabinet into the first interspace region;
• the cooling air entering the cabinet through a plurality of side inlet orifices defined by the first side surface and exiting the cabinet through a plurality of bottom exhaust orifices defined by the bottom surface;
• directing the cooling air over the plurality of electronic modules in a substantially horizontal manner and substantially parallel to the front surface and the rear surface;
• the cooling air subsequently entering the second interspace region;
• and
• exhausting the cooling air from the cabinet, wherein the cooling air removes at least 8,000 Watts of thermal energy from the cabinet.

A method of cooling electronic modules in a cabinet, comprising:

• the cabinet including a first side surface, a second side surface, a front surface and a rear surface, wherein the front surface-has a first front peripheral portion, a second front peripheral portion and a front central portion, wherein at least one of the first front peripheral portion and the second front peripheral portion define a plurality of front surface exhaust orifices;
• providing a plurality of chassis inside of the cabinet, wherein the plurality of chassis and the first side surface define a first interspace region, and wherein the plurality of chassis and the second side surface define a second interspace region;
• providing a plurality of electronic modules coupled to each of the plurality of chassis, wherein the plurality of electronic modules are substantially horizontally disposed within each of the plurality of chassis, and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each;
• providing an air moving apparatus coupled draw cooling air into the cabinet;
• the air moving apparatus drawing the cooling air external to the cabinet into the first interspace region;
• directing the cooling air over the plurality of electronic modules in a substantially horizontal manner and substantially parallel to the front surface and the rear surface;
• the cooling air subsequently entering the second interspace region;
• exhausting the cooling air from the cabinet, wherein the cooling air removes at least 8,000 Watts of thermal energy from the cabinet;
• and
• the cooling air exiting the cabinet through the plurality of front surface exhaust orifices without substantially impinging on a front outward projection space of the front central portion.

A method of cooling electronic modules in a cabinet, comprising:

• the cabinet including a first side surface, a second side surface, a front surface and a rear surface, wherein the rear surface has a first rear peripheral portion, a rear second peripheral portion and a rear central portion, wherein at least one of the first rear peripheral portion and the second rear peripheral portion define a plurality of rear surface exhaust orifices;
• providing a plurality of chassis inside of the cabinet, wherein the plurality of chassis and the first side surface define a first interspace region, and wherein the plurality of-chassis and the second side surface define a second interspace region;
• providing a plurality of electronic modules coupled to each of the plurality of chassis, wherein the plurality of electronic modules are substantially horizontally disposed within each of the plurality of chassis, and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each;
• providing an air moving apparatus coupled draw cooling air into the cabinet;
• the air moving apparatus drawing the cooling air external to the cabinet into the first interspace region;
• directing the cooling air over the plurality of electronic modules in a substantially horizontal manner and substantially parallel to the front surface and the rear surface;
• the cooling air subsequently entering the second interspace region;
• exhausting the cooling air from the cabinet, wherein the cooling air removes at least 8,000 Watts of thermal energy from the cabinet;
• and
• the cooling air exiting the cabinet through the plurality of rear surface exhaust orifices without substantially impinging on a rear outward projection space of the rear central portion.