Surface mountable chip type semiconductor device and manufacturing method
AssigneeNEC Electronics Corporation
InventorGorou Ikegami
Life of this patent
Estimating the term…
Abstract
A surface mountable chip type semiconductor device comprises: first and second conductive land areas which are formed on an insulating substrate and which are electrically coupled with each other; a conductive post formed on the first conductive land area; and a semiconductor pellet which has electrodes on both sides thereof and which is mounted on the second conductive land area. A main area of the insulating substrate including the conductive post and the semiconductor pellet is encapsulated by encapsulation resin. Top portions of the conductive post and an external electrode electrically coupled to the semiconductor pellet are exposed from the encapsulation resin. Top surfaces of the conductive post and the external electrode are approximately coplanar with each other.
Claims20
A chip type semiconductor device comprising:
- an insulating substrate;
- first and second conductive land areas which are formed on said insulating substrate and which are electrically coupled with each other;
- a conductive post formed on said first conductive land area;
- a semiconductor pellet which has electrodes on both sides thereof and which is mounted on said second conductive land area, said electrode on one side of said semiconductor pellet being coupled onto said second conductive land area and said electrode on the other side of said semiconductor pellet having an external electrode electrically coupled thereto;
- and
- encapsulation resin portion which encapsulates a main area of said insulating substrate including said conductive post and said semiconductor pellet, wherein top portions of said conductive post and said external electrode electrically coupled to said semiconductor pellet being exposed from said encapsulation resin portion.
A method of manufacturing a chip type semiconductor device comprising:
- preparing an insulating substrate;
- forming first and second conductive land areas on said insulating substrate, said first and second conductive land areas being electrically coupled with each other;
- forming a conductive post on said first conductive land area;
- mounting a semiconductor pellet which has electrodes on both sides thereof on said second conductive land area, said electrode on one side of said semiconductor pellet being coupled onto said second conductive land area and said electrode on the other side of said semiconductor pellet having an external electrode electrically coupled thereto;
- and
- encapsulating a main area of said insulating substrate including said conductive post and said semiconductor pellet with an encapsulation resin portion, wherein top portions of said conductive post and said external electrode electrically coupled to said semiconductor pellet being exposed from said encapsulation resin portion.
Dependencies are inferred from the claim text.