US 6,608,340 B1 · Substrate assembly having a depression suitable for an integrated circuit configuration and method for its fabrication

Abstract

A depression extends from a main surface of the substrate to the inside of said substrate and has an upper area and an adjacent lower area. A cross-section of the upper area, parallel to the main surface, is provided with at least one corner. A cross-section of the lower area, parallel to the main surface, matches the cross-section of the upper area, particularly in the vicinity the upper area, with the following difference: each corner is rounded, whereby the cross section of the lower area is smaller than the cross-section of the upper area. In order to produce the indentation, the upper area is provided with an auxiliary spacer that is rounded by isotropic etching. The lower area is produced by selectively etching the substrate to form an auxiliary spacer.

Claims4

Dependent claims

A substrate assembly having a depression that is suitable for an integrated circuit configuration, comprising:

a substrate having a main surface and a depression formed therein reaching into said substrate from said main surface;
said depression having:
an upper region with a substantially square cross-section parallel to said main surface, and having at least one corner;
a lower region adjacent to said upper region with a substantially circular cross-section parallel to said main surface, said substantially circular cross-section being smaller than said substantially square cross-section and having at least one round section corresponding respectively to said at least one corner of said substantially square cross-section.

1 more element

Dependencies are inferred from the claim text.

Substrate assembly having a depression suitable for an integrated circuit configuration and method for its fabrication

Life of this patent

Substrate assembly having a depression suitable for an integrated circuit configuration and method for its fabrication

Life of this patent

Abstract

Claims4