Grounded fill in a large scale integrated circuit
AssigneeSun Microsystems, Inc.
InventorsPankaj Dixit, Timothy Horel, Mu-Jing Li, Ward Vercruysse
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Abstract
An integrated circuit has a plurality of metal layers separated by a plurality of insulating layers. The integrated circuit comprises a pair of conductors on a first metal layer; at least one conductive fill element disposed between the conductors; and a via connecting the fill element to a ground contact on a metal layer adjacent to said first metal layer, where the via is formed of a conductive material.
Claims18
An integrated circuit having a substrate upon which is disposed a plurality of metal layers separated by a plurality of insulating layers, the integrated circuit comprising:
- a ground contact on a first metal layer of the plurality of metal layers;
- a pair of conductors on a second metal layer of the plurality of metal layers, wherein said second metal layer is disposed between said first metal layer and the substrate;
- at least two conductive fill elements disposed between said pair of conductors;
- a strap connecting said at least two conductive fill elements to one another, wherein said strap is formed of a conductive material;
- and
- a via connecting one of said at least two conductive fill elements to said ground contact, wherein said via is formed of a conductive material.
An integrated circuit having a substrate upon which is disposed a plurality of metal layers separated by a plurality of insulating layers, the integrated circuit comprising:
- a ground contact on a first metal layer of the plurality of metal layers;
- a pair of conductors on a second metal layer of the plurality of metal layers, wherein said second metal layer is disposed between said first metal layer and the substrate;
- at least a first conductive fill element disposed in a fill area between said pair of conductors on said second metal layer;
- a via connecting said at least a first conductive fill element to said ground contact, wherein said via is formed of a conductive material;
- a pair of conductors on a third metal layer of the plurality of metal layers, wherein said third metal layer is disposed between said second metal layer and the substrate;
- at least a second and a third conductive fill elements disposed between said pair of conductors on said third metal layer;
- a strap connecting said at least a second and a third conductive fill elements to one another, wherein said strap is formed of a conductive material;
- and
- a via connecting one of said at least a second and a third conductive fill elements to said at least a first conductive fill element, wherein said via is formed of a conductive material.
Dependencies are inferred from the claim text.