Method of definition of two self-aligned areas at the upper surface of a substrate
AssigneeSTMicroelectronics S.r.l.
InventorYvon Gris
Life of this patent
Estimating the term…
Abstract
A method for defining, on the upper surface of a substrate, two self-aligned areas, including the steps of depositing a protective layer; depositing a covering layer; opening the protective and covering layers at a location substantially corresponding to the desired border of the two areas; forming a spacer along the side of the opening, this spacer having a rear portion against said border and an opposite front portion; opening the protective and covering layers behind the rear portion of the spacer; and removing the protection layer to reach the rear portion of the spacer; whereby two self-aligned areas are defined on either side of the spacer length.
Claims6
A method for defining, on an upper surface of a substrate, two self-aligned areas, including the steps of:
- depositing a protective layer;
- depositing a covering layer;
- opening the protective and covering layers at a location substantially corresponding to a desired border of the two areas;
- forming a spacer along the edge of the opening, the spacer having a rear portion against said desired border and an opposite front portion;
- opening the protective and covering layers behind the rear portion of the spacer;
- removing the protective layer to reach the rear portion of the spacer;
- and
- inserting a material in the space between the substrate and the covering layer.
Dependencies are inferred from the claim text.