Positioning structure for heat dissipating fins
AssigneesWaffer Technology Corp., Jack Wang
InventorsJack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
Life of this patent
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AssigneesWaffer Technology Corp., Jack Wang
InventorsJack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
Estimating the term…
A positioning structure for heat dissipating fins is provided. The heat dissipating fins is comprised of multiple metal plates, each of which comprising a main body, and a folded side portion connected to one or two sides of the main body. The positioning structure is disposed on each of the metal plates. The positioning structure comprises a protrusion located on the main body of the metal plate, an aperture being formed on the main body, the protrusion formed in the aperture; and a resilient snapping piece located on the folded side portion, the snapping piece corresponding to the protrusion and defining a buckling opening therein, the buckling opening being connected to a front opening having a width normally smaller than the width of the protrusion.
A positioning structure for heat dissipating fins, the heat dissipating fins being comprised of multiple metal plates, each of the metal plates comprising a main body, and a folded side portion connected to one or two sides of the main body, the positioning structure disposed on each of the metal plates, the positioning structure comprising:
Dependencies are inferred from the claim text.