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US 6,605,873 B1Granted
Integrated electronic device comprising a mechanical stress protection structure
AssigneeSTMicroelectronics S.r.l.
InventorsBenedetto Vigna, Enrico Maria Alfonso Ravanelli
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Abstract
The integrated electronic device comprises a protection structure of metal, extending vertically and laterally to and along a predominant part of the periphery of an electronic component integrated underneath the pad region. The protection structure comprises a substantially annular region formed from a second metal layer and absorbing the stresses exerted on the pad during wire bonding. The annular region may be floating or form part of the path connecting the pad to the electronic component.
Claims18
An integrated electronic device comprising:
- a semiconductor material body;
- an electronic component housed in said semiconductor material body and having a periphery;
- an electrically insulating region extending on top of said semiconductor material body and including a central portion positioned directly above all of the electronic component;
- a pad region extending on top of said electrically insulating region;
- and
- a protection structure of a material different from and extending into said electrically insulating region, said protection structure contacting and extending downward from portions of the pad region that are not directly above said electronic component, said protection structure including a peripheral portion extending around a predominant part of the central portion of the electrically insulating region.
3 more elements
An integrated electronic device comprising:
- a semiconductor material body;
- an electronic component positioned at a surface of the semiconductor material body;
- a contact pad positioned above and electrically connected to the electronic component;
- and
- a protection structure having an annular peripheral portion in contact with and supporting the contact pad on the semiconductor material body.
2 more elements
Dependencies are inferred from the claim text.