Pressure-contact type semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsEitaro Miyake, Satoshi Yanagisawa
Life of this patent
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Abstract
A pressure-contact type semiconductor device comprises a plurality of semiconductor elements (IGBTs) which are in pressure contact with one another, and in which first main electrodes are electrically connected to a first common main power source plate (pressure-contact type emitter electrode plate), and second main electrodes are electrically connected to a second common main power source plate (pressure-contact type collector electrode). The pressure-contact type semiconductor device also includes a common control signal board which is constituted by a printed circuit board or a multi-layered printed circuit board, and extends over spaces between rows of semiconductor elements, thereby forming a path for sending a control signal.
Claims39
A pressure-contact type semiconductor device comprising:
- a plurality of semiconductor elements each of which has a first main electrode and a control electrode positioned on a front surface and a second main electrode positioned on a rear surface;
- a second common main power source plate having the semiconductor elements positioned on a front surface and electrically connected to the second main electrodes;
- a first common main power source plate arranged on the front surface of the semiconductor elements and electrically connected to the first main electrodes of the semiconductor elements, said first common main power source plate having first gibbosity electrodes positioned along its peripheral edge, and second gibbosity electrodes positioned at the center thereof;
- and
- a common control signal board which is in the shape of a mesh sheet and which has electrode openings for the semiconductor elements and which is electrically connected to the control electrodes of the semiconductor elements.
A pressure-contact type semiconductor device comprising:
- a plurality of semiconductor elements each of which has a first main electrode and a control electrode positioned on a front surface and a second main electrode positioned on a rear surface;
- a first common main power source plate arranged on the front surface of the semiconductor elements and electrically connected to the first main electrodes of the semiconductor elements;
- and
- a second common main power source plate having the semiconductor elements positioned on a front surface and electrically connected to the second main electrodes;
- a common control signal board which is formed by a printed circuit board, and being arranged between rows of the semiconductor elements and along the outside of the semiconductor elements, and being electrically connected to the control electrodes of the semiconductor elements.
Dependencies are inferred from the claim text.