Semiconductor device with improved cooling efficiency and reduced electric resistance
AssigneeNEC Electronics Corporation
InventorNaoto Kimura
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Abstract
The present invention provides a semiconductor device comprising: a tape wiring substrate; a semiconductor element mounted one main surface of the tape wiring substrate; a solder ball or pump electrode provided on the other surface of the tape wiring substrate while electrically connected with a predetermined position of the main surface of the tape wiring substrate including the semiconductor element; and a hollow pipe-shaped substrate; wherein the tape wiring substrate is wound around the hollow pipe-shaped substrate with the main surface arranged toward the hollow pipe-shaped substrate.
Claims6
A semiconductor device comprising:
- a tape wiring substrate;
- a semiconductor element mounted on a main surface of the tape wiring substrate;
- a solder ball or bump electrode provided on the other surface of the tape wiring substrate while electrically connected with a predetermined position of the main surface of the tape wiring substrate including the semiconductor element;
- and
- a hollow pipe-shaped substrate;
- wherein the tape wiring substrate is wound around the hollow pipe-shaped substrate with the main surface arranged toward the hollow pipe-shaped substrate.
Dependencies are inferred from the claim text.