Support matrix for integrated semiconductors, and method for producing it
AssigneeInfineon Technologies AG
InventorsKnut Kahlisch, Henning Mieth
Life of this patent
Estimating the term…
Abstract
Support matrices for semiconductors are often disposed with spacers on the semiconductor chip. The spacers are composed of silicone that flows into the region of the bonding leads and prevents reliable electrical connection of the bonding leads to the semiconductor chip. In order to prevent the flow, the support matrix for integrated semiconductors has a frame, conductor track structures and at least one bonding lead for connecting the conductor track structures to the integrated semiconductor. The bonding lead has, between a bonding region and the conductor track structures, at least one barrier for preventing the flow of flowable material onto the bonding region. A method for producing such support matrices is likewise described.
Claims10
A support matrix for an integrated semiconductor with a contact, comprising:
- a frame;
- conductor track structures running on said frame;
- at least one bonding lead for connecting said conductor track structure to the integrated semiconductor;
- and
- flowable silicone structure disposed in a region of said at least one bonding lead and spacing apart the support matrix and the integrated semiconductor;
- said at least one bonding lead having a bonding region to be pressed onto the contact point of the integrated semiconductor, and a barrier formed on a surface of said at least one bonding lead carrying said bonding region preventing a flow of said flowable silicone structure onto said bonding region;
- said at least one bonding lead having an anchor and a mating anchor disposed opposite said anchor for connecting to said frame, said barrier being disposed in a region of said anchor, and said at least one bonding lead having a further barrier disposed in a region of said mating anchor.
A method for producing a support matrix for an integrated semiconductor with a contact point which, comprises the step of:
- providing a frame having conductor track structure disposed thereon, and at least one bonding lead connected to the conductor track structure for connecting the conductor track structure to an integrated semiconductor, the at least one bonding lead having a bonding region to be pressed onto the contact point, an anchor and a mating anchor disposed opposite the anchor for connecting to the frame;
- forming flowable silicone structure on the frame serving to space apart the support matrix and the semiconductor;
- and
- forming a barrier in region of the anchor and a further barrier in a region of the mating anchor for preventing the flow of the flowable silicone structure onto the bonding region.
A support matrix for an integrated semiconductor with a contact point, comprising:
- a frame;
- conductor track structure running on said frame, said conductor track structure having at least one bonding lead for connecting said conductor track structure to the integrated semiconductor;
- and
- silicone structure disposed in a region of said at least one bonding lead and spacing apart the support matrix and the integrated semiconductor, said silicone structure formed from a flowable material;
- said at least one bonding lead having a bonding region to be pressed onto the contact point of the integrated semiconductor, and a barrier formed on a surface of said at least one bonding lead carrying said bonding region preventing a flow of said flowable material onto said bonding region before said silicone structures solidify;
- said at least one bonding lead having an anchor and a mating anchor disposed opposite said anchor for connecting to said frame, said barrier being disposed in a region of said anchor, and said at least one bonding lead having a further barrier disposed in a region of said mating anchor.
Dependencies are inferred from the claim text.