Semiconductor drive
AssigneeKoninklijke Philips Electronics N.V.
InventorAlbertus Theodorus Maria Van De Goor
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Abstract
The invention relates to a semiconductor device comprising a bond pad structure, which bond pad structure enables analyses to be carried out at a level of a metal layer of the semiconductor device and comprises a matrix comprising trenches filled with a conductive material, which matrix is electrically contacted by the metal layer.
Claims5
A semiconductor device comprising a bond pad structure, which bond pad structure enables analyses to be carried out at a level of a metal layer of the semiconductor device and comprises a matrix comprising trenches filled with a conductive material, which matrix is electrically contacted by a ring of the metal layer.
A semiconductor device comprising a bond pad structure that enables analyses to be carried out at a level of a metal layer of the semiconductor device, wherein the bond pad structure includes a conductive matrix in contact with a ring of the metal layer and wherein the conductive matrix comprises:
- a first set of trenches oriented in a first direction embedded in a first dielectric layer;
- and
- a second set of trenches oriented in direction perpendicular to the first direction embedded in a second dielectric layer.
Dependencies are inferred from the claim text.