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US 6,605,814 B1Granted
Apparatus for curing resist
AssigneeUshiodenki Kabushiki Kaisha
InventorsNozomu Tadika, Satoru Kuramochi, Yoshiki Mimura
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Abstract
A resist curing device including a workpiece stage with a plate adapted to support a silicon wafer laid thereupon, a workpiece retention device that vacuum adsorbs the silicon wafer laid upon the plate, a light source unit that provides ultraviolet irradiation to cure resist applied to the silicon wafer, and a workpiece temperature control device that heats and/or cools the silicon wafer supported on the plate, where the plate has an expansion coefficient substantially similar to that of the silicon wafer.
Claims2
A resist curing device comprising:
- a workpiece stage having pin holes and a workpiece transfer pin within each pin hole for ascending/descending transport of a silicon wafer;
- a separate, removable plate placed upon an upper surface of the workpiece stage which is composed of a silicon-based material and supports a silicon wafer laid thereon;
- a workpiece retention device that vacuum adsorbs the silicon wafer laid on the plate;
- a light source unit that provides ultraviolet irradiation to cure a resist applied to the silicon wafer;
- and
- a workpiece temperature control device that at least one of heats and cools the silicon wafer supported on the plate;
- wherein the plate has an expansion coefficient substantially similar to that of the silicon wafer and further includes through-holes to allow the workpiece retention device to vacuum adsorb the silicon wafer through the plate, and a pin hole in the plate which is aligned with each said pin hole and transfer pin in the workpiece stage.
4 more elements
Dependencies are inferred from the claim text.