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US 6,605,492 B2Granted
Plastic ball grid array assembly
AssigneeIntel Corporation
InventorJoseph C. Barrett
Life of this patent
Estimating the term…
Abstract
An apparatus for enclosing logic chips includes a substrate upon which a logic chip is mounted and a mold cap disposed upon the substrate and covering the logic chip. The mold cap includes at least one extension of sufficient size and shape to provide structural support to a corner section of the substrate.
Claims22
A method comprising:
- mounting a logic chip on a substrate;
- and
- forming a mold cap over the substrate such that the mold cap at least partially covers the logic chip, the forming comprising forming the mold cap with a plurality of extensions each extending into a respective corner section of the substrate for reinforcement without extending to an edge of the substrate.
A method comprising:
- mounting a logic chip on a substrate;
- and
- forming a mold cap over the substrate such that the mold cap at least partially covers the logic chip, the forming comprising forming the mold cap with a rounded extension extending into a corner section of the substrate for reinforcement of the substrate.
Dependencies are inferred from the claim text.