Resist pattern and method for forming wiring pattern
AssigneeMurata Manufacturing Co., Ltd.
InventorsKeiji Iwata, Toshio Hagi
Life of this patent
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Abstract
A resist pattern is provided on a substrate and includes a first resist layer provided on the substrate and defined by a first organic material which dissolves in an organic solvent, water, or a solvent primarily composed of water, a second resist layer defined by a second organic material provided on the first resist layer, the second organic material having a high absorbance of a light having a predetermined wavelength, and a third resist layer defined by a third organic material provided on the second resist layer, the organic material having a resistance to dry etching and being photosensitive to the light.
Claims14
A resist pattern provided on a substrate, comprising:
- a substrate;
- a first resist layer provided on the substrate and defined by a first organic material which dissolves in an organic solvent, water, or a solvent primarily composed of water;
- a second resist layer defined by a second organic material provided on the first resist layer, the second organic material having a high absorbance of a light having a predetermined wavelength;
- and
- a third resist layer defined by a third organic material provided on the second resist layer, the organic material having a resistance to dry etching that is greater than a resistance to dry etching of the first resist layer and being photosensitive to the light.
A method for forming a wiring pattern, comprising the steps of:
- providing a substrate;
- forming a first resist layer on the substrate, said first resist layer being defined by a first organic material which dissolves in an organic solvent, water, or a solvent primarily composed of water;
- forming a second resist layer on the first resist layer, the second resist layer being defined by a second organic material which has a high absorbance of a light having a predetermined wavelength;
- and
- forming a third resist layer on the second resist layer, the third resist layer being defined by a third organic material provided which has a resistance to dry etching that is greater than a resistance to dry etching of the first resist layer and is photosensitive to the light.
A method for forming a wiring pattern according 11, wherein the metal wiring pattern is formed on the substrate while keeping the substrate at a temperature of at least approximately 140° C.
Dependencies are inferred from the claim text.