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AssigneesFraunhofer-Gesellschaftt zur Forderung der Angewandten Forschung e.V., International Business Machines Corporation
InventorsTorsten Winkler, Ralf Blüthner, Klaus Goedicke, Michael Junghähnel, Hans Buchberger, Manfred Müller, Arno Hebgen, Hans-Hermann Schneider
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Production of a thin-film system containing at least one ultra-thin film, preferentially in the film thickness range from 1 to 10 nm, which is deposited by plasma-aided chemical or physical vapor-phase deposition using magnetron discharges. The method is characterized in that in the course of deposition of the ultra-thin film the power output is introduced into the plasma in the form of a controlled number of power pulses and that the average power output during the pulse-on time is set higher by a factor of at least 3 than the averaged power output over the entire coating time during deposition of the ultra-thin film.
Process of producing a thin-film system containing at least one ultra-thin film, which is deposited by plasma chemical vapor deposition or plasma physical vapor deposition using magnetron discharges, comprising depositing the ultra-thin film by introducing power output into plasma of the plasma chemical vapor deposition or plasma physical vapor deposition in the form of a controlled number of power pulses, and the average power output per unit time during pulse-on time is higher by a factor of at least 3 as compared to a total power output over a total coating time during deposition of the ultra-thin film.
Dependencies are inferred from the claim text.