Capture device for boards having variable thickness
AssigneeSun Microsystems, Inc.
InventorsLewis B. Sheen, Arthur S. Rousmaniere
Life of this patent
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AssigneeSun Microsystems, Inc.
InventorsLewis B. Sheen, Arthur S. Rousmaniere
Estimating the term…
A capture device for use with circuit boards of varying thicknesses prevents the spacing between the boards from increasing and has a unitary body including a flexible arm, a clip cavity and multiple living hinges that enable the device to be pivotally self-locked between the circuit boards. The capture device can be engaged and disengaged in poor visibility and limited access areas densely packed with circuit boards. The capture device may be made of a semi-rigid material that provides enough flexibility for the living hinges, yet is rigid enough to exert pressure on the boards and prevent the spacing between the boards from increasing. In alternative embodiments, more than two circuit boards may be secured using alternative configurations of the capture device with either multiple arms or multiple clip cavities.
An apparatus for removably securing multiple circuit boards comprising:
An apparatus for removably securing multiple circuit boards comprising:
A method for removably securing multiple circuit boards comprising:
A method for removably securing multiple circuit boards comprising:
Dependencies are inferred from the claim text.