Ultraviolet/electron beam forming process for multi-layer electronic components and products thereof
AssigneeAEM, Inc.
InventorsDaniel H. Chang, Xiang-Ming Li
Life of this patent
Estimating the term…
Abstract
A multilayered electronic component with or without inter-layer connections created by a process using radiation curing such as ultraviolet/electron beam curing techniques. UV light or electron beam curable binders are mixed with ceramic powders and metals powders to form a ceramic slurry and electrode ink, there is little or no solvent in the metal ink and ceramic slurry. Instead of drying, a UV or electron beam is used for curing the binders. These binders could contain UV/electron beam curable monomers or oligomers, photo initiators, and other additives to provide the desired chemical and physical properties in the forming process.
Claims24
A process of forming a multi-layer electronic component on a substrate, comprising the steps of:
- depositing over the substrate a first layer that comprises a first material in a first radiation curable binder;
- exposing the first layer to radiation to cure the first radiation curable binder to form a solid layer that remains a portion of the electronic component;
- depositing a second layer that comprises a second material in a second radiation curable binder over the first layer;
- and
- exposing the second layer to radiation to cure said second radiation binder.
A process of forming a multi-layer electronic component having interconnecting conductive layers, comprising the steps of:
- forming a first conductive layer that comprises a first material;
- forming a via that comprises a second material, over the first conductive layer;
- forming an insulating layer that comprises a third material, around the via;
- and
- forming a second conductive layer that comprises a fourth material,
- whereby at least two of the above forming steps each comprises the step of forming the corresponding layer by radiation curing a slurry that comprises corresponding material for the corresponding layer in a radiation curable binder.
A process of forming a multi-layer electronic component on a substrate, comprising the steps of:
- depositing over the substrate a first layer that comprises a first material, in a first curable binder;
- curing the first curable binder to form a solid layer;
- depositing a second layer that comprises a second material in a second curable binder over the first layer;
- and
- curing the second curable binder to form a solid layer.
A process of forming a multi-layer electronic component, comprising the steps of:
- forming a first layer by curing a layer that comprises a first material in a first curable binder to form a first solid layer;
- and
- forming a second layer over the first layer, by curing a layer that comprises a second material in a second curable binder to form a second solid layer.
A process of forming a multi-layer electronic component, comprising the steps of:
- forming a base structure;
- forming a first conductive structure over the base structure, the first conductive structure being formed by depositing a first layer of a first conductive material in a first curable binder in a manner that does not completely cover the base structure and curing said first layer in its entirety;
- forming a non-conductive structure over the base structure, by depositing a layer of a non-conductive material in a second curable binder over the base structure where it is not covered by the first conductive structure and curing said second curable binder;
- and
- forming a second conductive structure over the non-conductive layer,
- wherein the second conductive structure and the base structure are conductively coupled via the first conductive structure.
Dependencies are inferred from the claim text.