Modular controlled platen preparation system and method

Abstract

A system and method are disclosed for preparing platens to perform lapping operations. The system includes a platter that is rotatably mounted on a base and designed to receive the platen thereon. A main drive motor is provided for rotating the platter and the platen disposed thereon. A plurality of pressure arms are disposed on the base and configured to include a tool receiving portion that can be positioned in alignment with a lapping surface of the platen, and configured to softly touch a tool to a platen. A tool is attached to each tool receiving portion so that predetermined operations can be performed on the lapping surface of the platen. A monitor is provided to monitor predetermined parameters and maintain substantially constant conditions while preparing the platen.

Dependencies are inferred from the claim text.